Language versionZNEN

Light-emitting diode epoxy resin packaging material

Order consultation Online Message
SHARE   |   Data download

product details

Product introduction

High - temperature curing epoxy resin packaging materials, mainly used in advanced light-emitting diode packaging. This product has good weather resistance and strong uv resistance. It can be used outdoors for a long time without discoloration.

Master product features

The essence is LED glue containing mold release agent, which is used for LED packaging and molding. Its biggest characteristic is good transparency, high temperature resistance and non-discoloration. After mixing, it has low viscosity, good fluidity, easy to defoaming, and can be used for a long time.

Heat can be cured at medium or high temperature, curing speed is fast.

Low shrinkage, good moisture resistance, good gloss and high hardness after curing; Curing material mechanical strength, excellent electrical properties, moisture and heat resistance and atmospheric aging.

application area

  • 发光二极管
  • 发光二极管
  • 发光二极管
  • 发光二极管
  • 发光二极管
  • 发光二极管
Copyright:安徽众博新材料有限公司 皖ICP备15017939号
Design and production:WANGXINKEJI